Models
|
PoliJet System – 9900
|
|
![]() |
||
RIP
|
PoliRIP V2.08 – 9900
|
|
Image Rendering | Halftone (screened 1-bit) | |
Contone (colour 8-bit) | ||
Screening | Standard PostScript Screening | |
Adobe Accurate Screening | ||
Agfa Balanced Screening | ||
PerfectBLEND Screening | ||
Linearisation | Yes | |
Press Dot Gain Compensation | Yes | |
Advanced Scan LIGHT | Optional | |
StripRITE Imposition | Yes | |
Adobe InRip Trapping | Optional | |
KoolToning Halftone Simulator | Optional | |
System Requirement | Processor – Pentium IV | |
RAM – 256 MB (Preferable 1 GB+) | ||
Hard Drive – 1×40 GB (or more) | ||
Operating System – Windows XP Pro (or Windows 2000 Pro) | ||
Imaging Device
|
PoliJet Inkjet Platesetter – 9900
|
|
Imaging Technology | Advanced Micro PiezoTM TFP (Thin Film Piezo) drop-on-demand technology |
|
Variable-sized Droplet Technology and 3.5 pl Ultra Micro DotTM | ||
Interfaces (Standard) | USB 2.0 (Compatible with 1.1), 10/100Mb Base EthernetONT> | |
Operating Voltage | AC 100V – 120V verison, 220V – 240V version | |
Operating Current | 1.0A for 100-120V, 0.5A for 220-240V | |
Operating Frequency | 50 – 60 Hz | |
Power Consumption (operating) | 80 W or less | |
Dimension (w x d x h) |
73″ x 26″ x 48″ | |
1864 x 667 x 1218 mm | ||
Weight (approximately) | 116 kg / 256 lb | |
Acoustic Noise Level | <50 dB(A) | |
Warranty | One year. For more information please refer to www.epson.com | |
Baking Oven(PoliJet Baking Oven)
|
CP – 850
|
|
Fuser Type | Conveyorised | |
Feed opening | 850mm | |
Operating Voltage | AC 220-240 Volts | |
Operating Frequency | 50 / 60 Hz | |
Power | 1000Watts | |
Dimension (w x d x h) (mm)(including the tray dimension – as applicable) |
1160x145x650 | |
Weight (approximately) | 45 Kg / 100 lb | |
PoliJet
|
PoliJet Offset Plates
|
|
Base Material | Polyester | |
Coating | Proprietory Hydrophilic Coating | |
Imaging Fluid | Epson UltrachromeTM HDR Ink | |
Imaging Quality | 150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max) | |
Operating Enviornment (Temperature and Humidity) | 50° to 75° F (10° to 24° C) less than 30% Relative Humidity | |
Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.) | Two sets of 4 colour seperation per hour (bi-di imaging) – 7900/9900 | |
Baking Temperature | Surface temperature of 110oC | |
Baking Time | 2 mins | |
Max. Plate Width | 820 mm | |
Plate Thickness | 0.15, 0.20, 0.28mm |