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PoliJet 7900

For Imaging PoliJet Plates

  • PoliJet System – 4880
  • PoliJet System – 7900
  • PoliJet System – 9900

Models
PoliJet System – 9900
RIP
PoliRIP V2.08 – 9900
Image Rendering Halftone (screened 1-bit)
Contone (colour 8-bit)
Screening Standard PostScript Screening
Adobe Accurate Screening
Agfa Balanced Screening
PerfectBLEND Screening
Linearisation Yes
Press Dot Gain Compensation Yes
Advanced Scan LIGHT Optional
StripRITE Imposition Yes
Adobe InRip Trapping Optional
KoolToning Halftone Simulator Optional
System Requirement Processor – Pentium IV
RAM – 256 MB (Preferable 1 GB+)
Hard Drive – 1×40 GB (or more)
Operating System – Windows XP Pro (or Windows 2000 Pro)
Imaging Device
PoliJet Inkjet Platesetter – 9900
Imaging Technology Advanced Micro PiezoTM
  TFP (Thin Film Piezo) drop-on-demand technology
Variable-sized Droplet Technology and 3.5 pl Ultra Micro DotTM
Interfaces (Standard) USB 2.0 (Compatible with 1.1), 10/100Mb Base EthernetONT>
Operating Voltage AC 100V – 120V verison, 220V – 240V version
Operating Current 1.0A for 100-120V, 0.5A for 220-240V
Operating Frequency 50 – 60 Hz
Power Consumption (operating) 80 W or less
Dimension
(w x d x h)
73″ x 26″ x 48″
1864 x 667 x 1218 mm
Weight (approximately) 116 kg / 256 lb
Acoustic Noise Level <50 dB(A)
Warranty One year. For more information please refer to www.epson.com
Baking Oven(PoliJet Baking Oven)
CP – 850
Fuser Type Conveyorised
Feed opening 850mm
Operating Voltage AC 220-240 Volts
Operating Frequency 50 / 60 Hz
Power 1000Watts
Dimension
(w x d x h) (mm)(including the tray dimension – as applicable)
1160x145x650
Weight (approximately) 45 Kg / 100 lb
PoliJet
PoliJet Offset Plates
Base Material Polyester
Coating Proprietory Hydrophilic Coating
Imaging Fluid Epson UltrachromeTM HDR Ink
Imaging Quality 150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max)
Operating Enviornment (Temperature and Humidity) 50° to 75° F (10° to 24° C) less than 30% Relative Humidity
Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.) Two sets of 4 colour seperation per hour (bi-di imaging) – 7900/9900
Baking  Temperature Surface temperature of 110oC
Baking Time 2 mins
Max. Plate Width 820 mm
Plate Thickness 0.15, 0.20, 0.28mm